نویسندگان
دانشکده مهندسی پلیمر و رنگ، دانشگاه صنعتی امیر کبیر
چکیده
کلیدواژهها
عنوان مقاله [English]
نویسندگان [English]
Conductive inks are new generation of inks, , which have many applications in organic solar cells (OSCs), organic light emitting diodes (OLEDs), antennas, radio frequency identifier (RFID) and electronic circuits. Silver and copper are typical metals used in these types of inks. Nano silver ink is a good choice due to its resistance to oxidation. However, by overcoming the oxidation problem of Cu inks, they can be an effective substitute for Ag inks for being less expensive and having higher conductivity. Metal nanoparticles should be exposed to heat, after synthesis and loading in ink, in order to make a uniform solid film and minimize its electrical resistance. Due to the high surface energy of metal nanoparticles, they have a lower melting point than bulk metals. The reported temperatures for the melting point and sintering point of metal nanoparticles is in the range of 200 degree of centigrade and due to this high temperature they cannot be applied on the polymeric substrates. Among different chemical methods to synthesize copper NPs, the chemical reduction method is the best from the point of different advantages like controlling the size and morphology of final NPs by varying the reaction parameters such as surface protecting agent’s concentration, reducing agent’s concentration, temperature, pH and so on. Generally it has been seen that by increasing the reducing agent and capping agent’s concentration the particle sizes decrease and also increasing the reaction temperature and pH of the reaction causes more nucleus and results in smaller particle sizes. In this study the mechanism of each parameter is studied
کلیدواژهها [English]
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